Allied Component Works spins a clean and simple development board for the OSD32MP15x SIP processor from Octavo Systems The latest system-in-package (SIP) processor from Octavo Systems, the OSD32MP15x, offers a complex computing platform neatly integrated in a tiny ball grid array (BGA) package that easily supports cost effective low density designs.  Based on STMicroelectronics STM32MP1

Octavo Systems takes the work and expense out of designing full featured computing power into deeply embedded applications with system in package solutions. Not long ago designers of computing subsystems for deeply embedded industrial applications faced a stark choice.  On one hand, inexpensive and easily managed microcontroller solutions are available with an increasingly dizzying array